Exclusive

Publication

Byline

Location

US Patent Issued to FCA US on Oct. 21 for "Distributed electrically variable transmission" (Michigan Inventor)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,447,813, issued on Oct. 21, was assigned to FCA US LLC (Auburn Hills, Mich.). "Distributed electrically variable transmission" was invented by ... Read More


US Patent Issued to Beijing Zitiao Network Technology on Oct. 21 for "Laminated unit for printed circuit board and printed circuit board" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,453,005, issued on Oct. 21, was assigned to Beijing Zitiao Network Technology Co. Ltd. (Beijing). "Laminated unit for printed circuit board and... Read More


US Patent Issued to Daifuku on Oct. 21 for "Article transport facility" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,452,706, issued on Oct. 21, was assigned to Daifuku Co. Ltd. (Osaka, Japan). "Article transport facility" was invented by Yuki Ihira (Komaki, J... Read More


US Patent Issued to Sharrow Engineering on Oct. 21 for "Propeller" (Michigan Inventor)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,448,098, issued on Oct. 21, was assigned to Sharrow Engineering LLC (Shelby Township, Mich.). "Propeller" was invented by Gregory Charles Sharr... Read More


US Patent Issued to CANON on Oct. 21 for "Imprint apparatus and method of manufacturing article" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,449,739, issued on Oct. 21, was assigned to CANON K.K. (Tokyo). "Imprint apparatus and method of manufacturing article" was invented by Ryosuke... Read More


US Patent Issued to GE ENERGY POWER CONVERSION TECHNOLOGY on Oct. 21 for "Hybrid modular multi-level converter (HMMC) and modular multi-level converter (MMC)" (New York Inventor)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,794, issued on Oct. 21, was assigned to GE ENERGY POWER CONVERSION TECHNOLOGY Ltd. (Warwickshire, Great Britain). "Hybrid modular multi-lev... Read More


US Patent Issued to Hitachi Astemo on Oct. 21 for "Electronic control device and method for setting control data" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,449,801, issued on Oct. 21, was assigned to Hitachi Astemo Ltd. (Hitachinaka, Japan). "Electronic control device and method for setting control... Read More


US Patent Issued to Anonyome Labs on Oct. 21 for "Hardware security module to control a cloud decentralized identity wallet" (Australian, American Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,450,594, issued on Oct. 21, was assigned to Anonyome Labs Inc. (Salt Lake City). "Hardware security module to control a cloud decentralized ide... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 21 for "Etch stop layer for semiconductor devices" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,393, issued on Oct. 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Etch stop layer for semiconductor d... Read More


US Patent Issued to Rutgers, The State University of New Jersey on Oct. 21 for "Methods for low energy inorganic material synthesis" (New Jersey Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,448,700, issued on Oct. 21, was assigned to Rutgers, The State University of New Jersey (New Brunswick, N.J.). "Methods for low energy inorgani... Read More